- tungsten, molybdenum, tantalum, niobium and rhenium,
ods-copper,cemented carbide.
Products
Tungsten copper & tungsten silver
Material Property:
With the 6~50% copper(by weight), the W-Cu alloy has integrated both advantages of tungsten and copper. Characterized by good high temperature resistance, arc ablation resistance, thermal and electrical conductivity , high strength, machining-ease, and outstanding sweat cooling ability and specific gravity ,it is widely applied in machinery, electric power, electronics, metallurgy, aerospace and other industries.
Application:
Tungsten Copper composite materials are widely used in:- Switches or circuit breakers of arc contact and vacuum contact in medium-high voltage application
- Electrodes used for EDM
- High- temperature -resistance materials
- Heat spreader on electronic equipment
- Electrodes in electric resistance welding
- Electronic packaging materials and heat sink materials
-- Microwave, laser, radio frequency (rf), optical communication and other high power devices
-- Lead frame of the high performance
-- Thermal controlling panel and dissipation devices of military and civilian use
- Components for Aeronautics and astronautic
Product Specification:
Chemical Components & Physical Properties of Tungsten Copper Composite
|
Grades |
Chemical Elements |
Density |
Hardness |
Resistivity |
Electrical Conductivity |
Bending Strength |
|
|
Cu |
W |
g/cm3(≥) |
HB(≥) |
μΩ·cm(≤) |
%(≥) |
MPa(≥) |
|
|
W93Cu7 |
7±2 |
balance |
17.3 |
270 |
6.3 |
25 |
1230 |
|
W90Cu10 |
10±2 |
balance |
16.75 |
260 |
6.5 |
27 |
1160 |
|
W85Cu15 |
15±2 |
balance |
15.90 |
240 |
5.7 |
30 |
1080 |
|
W80Cu20 |
20±2 |
balance |
15.15 |
220 |
5.0 |
34 |
980 |
|
W75Cu25 |
25±2 |
balance |
14.50 |
195 |
4.5 |
38 |
885 |
|
W70Cu30 |
30±2 |
balance |
13.80 |
175 |
4.1 |
42 |
790 |
|
W65Cu35 |
35±2 |
balance |
13.3 |
155 |
3.9 |
44 |
-- |
|
W60Cu40 |
40±2 |
balance |
12.75 |
140 |
3.7 |
47 |
-- |
|
W55Cu45 |
45±2 |
balance |
12.30 |
125 |
3.5 |
49 |
-- |
|
W50Cu50 |
50±2 |
balance |
11.85 |
115 |
3.2 |
54 |
-- |
|
Requirements for tungsten copper series: total impurities<0.5%, Fe<0.1%, C<0.15%, SiO2<0.05%, Na+K<0.1%, others<0.1%. Additives such as nickel added to improve product performance are not impurities and should not exceed 1%. The ratio of tungsten to copper can be adjusted arbitrarily, WxCuy, x+y=100. The table above is just some of the commonly used grades. |
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Chemical Components & Physical Properties of tungsten silver Composite
|
Grades |
Chemical Elements |
Density |
Hardness |
Resistivity |
Electrical Conductivity |
Bending Strength |
|
|
Ag |
W |
g/cm3(≥) |
HB(≥) |
μΩ·cm(≤) |
%(≥) |
MPa(≥) |
|
|
W80Ag20 |
20±2 |
balance |
16.10 |
180 |
4.6 |
37 |
726 |
|
W75Ag25 |
25±2 |
balance |
15.40 |
165 |
4.2 |
41 |
686 |
|
W70Ag30 |
30±2 |
balance |
14.90 |
150 |
3.8 |
45 |
657 |
|
W65Ag35 |
35±2 |
balance |
14.50 |
135 |
3.6 |
48 |
-- |
|
W60Ag40 |
40±2 |
balance |
14.00 |
125 |
3.4 |
51 |
-- |
|
W55Ag45 |
45±2 |
balance |
13.55 |
115 |
3.2 |
54 |
-- |
|
W50Ag50 |
50±2 |
balance |
13.15 |
105 |
3.0 |
57 |
-- |
|
W40Ag60 |
60±2 |
balance |
12.40 |
85 |
2.6 |
66 |
-- |
|
W30Ag70 |
70±2 |
balance |
11.75 |
75 |
2.3 |
75 |
-- |
|
Requirements for tungsten silver series: total impurities < 0.5%, Cu < 0.1%, C < 0.15%, SiO2 < 0.05%, Na+K < 0.1%, others < 0.1%. Nickel and other additives added to improve product performance are not impurities, and the amount should not exceed 2%. The ratio of tungsten to silver can be adjusted arbitrarily, WxAgy, x+y=100. The table above is just some of the commonly used grades. |
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